Single Wafer Plasma Ashing System (SWP Series)
Damage-free, high throughput, multi-purpose compatible high-end devices, compound semiconductors, and MEMS. Extensive track record and comprehensive support. New type now available.
Achieved damage-less ashing using downflow plasma while eliminating charge-up damage. High throughput is realized through high-rate ashing with surface wave plasma (SWP) and an ashing chamber equipped with two rooms. In addition to ashing, the RIE chamber enables the removal of special resists and organic films, as well as the removal of hardened resists after ion implantation. It achieves both the removal of hardened resist on the surface and damage-less ashing of the underlying resist. The adoption of a compact single-wafer load lock chamber and twin-hand robots allows for a compact installation size. Proven capability to handle not only standard wafers but also special substrates such as wafers thicker than 1 mm and rectangular substrates. A versatile single-wafer etching and ashing device.
- Company：神港精機 東京支店
- Price：Other
